THE NOOHAPOU DIARIES

The Noohapou Diaries

The Noohapou Diaries

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The POU3500 procedure delivers dynamic temperature control of the process read more chamber cathode / electrode / anode and may be synchronized with any etch method.

Software & TCU computer software calibration strategies vary exterior test tools not applied frequently for verifying

the knowledge under is categorized by semiconductor course of action and tool maker. Every single desk contains an programs Matrix that exhibits qulified and industrial processes.

initially Launched in 1985, our corporation has developed into a acknowledged leader in furnishing temperature Regulate units to the worldwide semiconductor field.

This remarkable process, supplying a small variety aspect, inexpensive-of-possession and Dynamic Temperature Control available process and products engineers a new tool to enhance their temperature sensitive procedures.

The accuracy of your POU 3300 permits unbiased control of the method fluid temperature towards the wafer chuck within just +/- 0.1 °C of established point, and also the rapid reaction time in the procedure will allow for maximum wafer-to-wafer repeatability throughout the etch process.

All static TCUs require excess cooling & heating capacities due to their very large course of action fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature control technique is lower than one gallon.

With our unit strategically mounted somewhere around six toes in the chamber, we achieve a way more correct reading through of your chuck temperature. This method makes sure consistent temperature all through the generation large amount, bringing about enhanced wafer-to-wafer CD uniformity.

significant Footprint: Static models occupy considerable Area in the fabrication tool space, decreasing its efficiency.

LAUDA-Noah is meeting these new challenges and has incorporated Power preserving technologies in systems which are pleasant to your ecosystem and have a low price to operate.

The TEs' can change straight from heating to cooling, or visa-versa. they might activate & off whilst in the heating or cooling method and may raise or lower the level of heating or cooling devoid of switching whatsoever.

a lot more than ever, shrinking machine geometries, demanding new procedures plus a highly aggressive atmosphere demand temperature Regulate programs that Merge rapid and correct temperature control by having an emphasis on decreased working expenditures and enhanced trustworthiness.

the truth is true Dynamic Temperature Manage can only be reached when all five (five) of the following program design and installation requirements are satisfied:

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We need much less cooling/heating potential for the same software as a static TCU as a consequence of our little reservoir volume.

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